American chip giant Intel has partnered with Japanese tech and investment powerhouse SoftBank to build a stacked DRAM substitute for HBM. According to Nikkei Asia, the two industry behemoths set up Saimemory to build a prototype based on Intel technology and patents from Japanese academia, including the University of Tokyo.

TSMC reiterated its long-known stance on next-generation High-NA EUV lithography tools at its European Technology Symposium in Amsterdam. The company does not require these highest-end lithography systems for its next-generation process technologies, including A16 (1.6nm-class) and A14 (1.4nm-class) process technologies.

On Tuesday, Intel notified Tom's Hardware that it officially cut the suggested retail price (SRPs) of its boxed Core Ultra 7 200-series processors for desktops by around $100. It is common for CPU developers to cut the prices of their products, but it is uncommon for companies like Intel to formally confirm such moves. However, there is a small catch: since we are dealing with SRPs, actual prices may vary.

Die shots of AMD's 16-core Zen 5c CCD used in its latest EPYC 9005 series server processors have been exposed, revealing clear differences compared to AMD's previous-generation Zen 4c CCDs. Posted by HXL on X, photos of AMD's 16-core 3nm Zen 5c CCD expose a long row of two banks of cores flanking a 32MB layer of L3 cache in the middle of the die.