Memory manufacturer G.Skill just announced two new high-capacity memory modules overclocked to DDR5-6000 CL32 and DDR5-6400 CL36. Previously, high-performance memory kits were limited to smaller modules.

Although AMD formally introduced its Ryzen Threadripper 9000-series processors at Computex and disclosed their specifications, the company did not reveal their performance compared to predecessors and rivals, or their pricing.

American chip giant Intel has partnered with Japanese tech and investment powerhouse SoftBank to build a stacked DRAM substitute for HBM. According to Nikkei Asia, the two industry behemoths set up Saimemory to build a prototype based on Intel technology and patents from Japanese academia, including the University of Tokyo.

TSMC reiterated its long-known stance on next-generation High-NA EUV lithography tools at its European Technology Symposium in Amsterdam. The company does not require these highest-end lithography systems for its next-generation process technologies, including A16 (1.6nm-class) and A14 (1.4nm-class) process technologies.