TSMC reiterated its long-known stance on next-generation High-NA EUV lithography tools at its European Technology Symposium in Amsterdam. The company does not require these highest-end lithography systems for its next-generation process technologies, including A16 (1.6nm-class) and A14 (1.4nm-class) process technologies.

On Tuesday, Intel notified Tom's Hardware that it officially cut the suggested retail price (SRPs) of its boxed Core Ultra 7 200-series processors for desktops by around $100. It is common for CPU developers to cut the prices of their products, but it is uncommon for companies like Intel to formally confirm such moves. However, there is a small catch: since we are dealing with SRPs, actual prices may vary.

Die shots of AMD's 16-core Zen 5c CCD used in its latest EPYC 9005 series server processors have been exposed, revealing clear differences compared to AMD's previous-generation Zen 4c CCDs. Posted by HXL on X, photos of AMD's 16-core 3nm Zen 5c CCD expose a long row of two banks of cores flanking a 32MB layer of L3 cache in the middle of the die.

In a surprising turn of events, Chinese DRAM maker Changxin Memory (CXMT) is considering hiking the prices of its DDR4 memory after demand and supply stabilized, according to DigiTimes. According to TrendForcethat has, CXMT is not the only company to increased DRAM pricing in recent months. Keep in mind that the information is unofficial, though.

While the whole market was looking at the appointment of Lip-Bu Tan as Intel chief executive, there was another major development at the company this week: The first 18A (1.8nm-class) wafers are running around Intel's Arizona fab. Intel's Fab 52 and Fab 62 in Arizona are high-volume production facilities, so running 18A fabs there is a major milestone for the company.

AMD's latest additions to its Zen 5 stack include the 16-core Ryzen 9 9950X3D and 12-core 9900X3D, set to launch on March 12. Just days before the retail embargo, a handful of Ryzen 9 9950X3D samples appear to have been tested in PassMark, a benchmarking utility (via x86deadandback on X).

Micron introduced its 16Gb DDR5 devices made on its new 1γ (1-gamma) fabrication process that uses EUV lithography, a first for Micron, today on March 25. The new IC not only delivers higher performance than its predecessor, but it also consumes less power and is poised to be cheaper to make.

In a flurry of tweets detailing Intel's upcoming processors, avid hardware leaker Jaykihn has shared specifications for Panther Lake and Wildcat Lake. Arriving in H2 this year, Panther Lake is the successor to Arrow Lake-H, which launched at this CES. Meanwhile, Wildcat Lake is rumored to power Intel's next-gen N-series chips, designed for lightweight laptops and mini-PCs.

Hua Hong Semiconductor, China's second-largest chip foundry, has made strategic leadership changes to prioritize logic chip production and develop more advanced process technologies. The company hired Bai Peng, a veteran in logic chip technology, and appointed him president on January 1, 2024, reports Nikkei.

While AMD mainly focused on its forthcoming high-end advances at CES 2025 this year, a new product for the budget market was quietly added to its website. The AMD Ryzen 5 9600 has been confirmed as a slightly down-tuned sibling of the 9600X, with MSRP and release date yet unknown.