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  • AMD’s upcoming Zen 6 Medusa Point 10-core APU pops up on Geekbench — chip is faster than Ryzen AI 9 HX 370 & even Ryzen AI Max+ 395
    July 9, 2026
    AMD is expected to announce its next-gen mobile CPUs at CES 2027, but leaks have already started to pour in, giving us a decent idea of the performance we can expect. Codenamed "Medusa Point," the Red Team's upcoming lineup will likely be based on the Zen 6 microarchitecture, and one of the SKUs has just popped up on Geekbench. It scored much better than the previous leak, beating most of its contemporaries. The part showed up as "AMD Eng Sample 100-000001713-33_N" and was marked under "AMD Plum-MDS1," which we know is the platform associated with Medusa Point.
  • China’s Loongson launches homegrown 16-core server CPU built on LoongArch architecture — 40W chip with DDR4 ECC and 32 PCIe lanes targets cheap SMB file, database, and web servers
    June 28, 2026
    Loongson Technology has announced the Loongson 3C3000, a new 16-core server processor aimed at low-cost general-purpose server systems. Unveiled on June 26, 2026, via a public corporate release, the chip is based on Loongson’s in-house architecture and is designed for small- and medium-sized business workloads, including file, database, web, and business process servers. Loongson says the 3C3000’s general-purpose computing performance matches that of the company’s earlier 3C5000 server processor.
  • AMD promises 13% uplift with new EXPO ‘Ultra Low Latency’ overclocking on DDR5 DIMMs — automatic memory overclocking delivers 4% improvement over standard EXPO, says AMD
    June 1, 2026
    AMD is bringing a new automatic memory overclocking feature out, dubbed EXPO Ultra Low Latency (ULL). The new tool promises a 13% uplift in average performance across over 30 games compared to JEDEC standard speeds for DDR5, as well as a 4% uplift compared to standard EXPO, at least according to AMD’s internal benchmarks. The company hasn’t said when ULL will be available, but it has several memory partners lined up to support the feature. We don’t know much about how EXPO ULL works, and more specifically, where AMD is finding improvements compared to standard EXPO. Despite that, AMD shared some broad benchmarks looking at EXPO ULL performance on a Ryzen 7 9700X CPU in over 30 games.
  • The Core Ultra 7 270K was too good, so Intel scrapped the flagship Core Ultra 9 290K Plus — benchmarks of the 290K prototype find slim 2% faster performance in gaming and applications
    May 18, 2026
    Intel canned the Core Ultra 9 290K Plus from the Arrow Lake refresh lineup announced a few months ago, despite a swirling of leaks and rumors confirming its existence. The chip ultimately never came out, but a Chinese reviewer just got their hands on an engineering sample and put it through the wringer — the underwhelming results in games and professional apps show why Intel likely chose to keep it in the archives.
  • AMD expands its Ryzen 9000 PRO lineup with six new SKUs, now featuring 3D V-Cache for the first time — new workstation CPUs have up to 170W TDPs, available with OEMs later this year
    May 13, 2026
    AMD has just launched six new Ryzen PRO series CPUs as part of its Ryzen 9000 family, bringing 3D V-Cache for the first time to this lineup, along with unlocking higher TDPs. The Ryzen PRO series is intended for workstation users who prioritize security and stability, even though they otherwise use identical silicon to mainstream desktop parts.
  • Intel teases wider range of overclockable CPUs for future platforms — VP Robert Hallock says budget builders ‘deserve the same level of features’ as more well-heeled enthusiasts
    April 22, 2026
    For over a decade, Intel has been consistent in restricting its unlocked, overclockable K-series CPUs exclusively to the mid-range and high-end CPU segments. Rare exceptions to this strategy have included the Pentium G3258 and Core i3-9350K. However, PC Games Hardware reports that Intel is looking to change this strategy in the future, and plans to introduce more overclocking-friendly CPUs at more affordable price points.
  • DRAM prices predicted to jump 63% in Q2, NAND up to 75% — follows 95% jumps in Q1, Trendforce says AI server demand keeps supply tight
    April 2, 2026
    Conventional DRAM contract prices will rise 58% to 63% quarter-over-quarter in Q2 2026, while NAND Flash contract prices will jump 70% to 75% QoQ, according to TrendForce's latest memory pricing survey. The increases follow a Q1 that saw DRAM contracts climb by a record 90% to 95% QoQ, meaning the rate of DRAM price growth has slowed somewhat, even as NAND Flash prices have accelerated sharply from the prior quarter's circa 60% increase.
  • AMD makes the flagship Ryzen 9 9950X3D2 official — first dual-cache X3D CPU arrives in April, with 208MB cache, 200W TDP, promising modest performance gains
    March 26, 2026
    AMD has announced the Ryzen 9 9950X3D2 Dual Edition, its newest flagship and the world’s first desktop CPU that stacks 3D V-Cache across both CCDs. The CPU comes with a massive 208MB (16MB L2 Cache + 192MB L3 Cache) of total cache to deliver a touted 5~ 10% performance boost over the Ryzen 9 9950X3D. While pricing has not been disclosed, AMD has confirmed that the CPU will be available for purchase starting April 22.
  • Intel announces Arrow Lake Refresh CPUs, claims 15% higher gaming performance and multi-threaded boost — Core Ultra 7 270K and Core Ultra 5 250K come with more cores, faster memory, and a price cut
    March 11, 2026
    Intel has finally revealed its long-awaited Arrow Lake Refresh CPUs. Dubbed Core Ultra 200S Plus, Intel is introducing two new chips in its lineup, both of which come with a price cut compared to their non-Plus predecessors. The headline claim is 15% higher gaming performance at 1080p compared to stock Arrow Lake chips — a number that Intel says it gathered from a geomean of 38 games tested at 1080p with High settings, in a bid to earn a spot among the best CPUs for gaming.
  • Corsair fights back against RAM scammers and thieves with packaging shift — ditches iconic yellow boxes for transparent plastic and anti-tampering labels
    February 13, 2026
    If you’ve purchased one of the best RAM kits on the market, specifically a Corsair Vengeance DDR5 memory kit, and noticed the packaging looks dramatically different, there's no need to panic. Corsair has recently revamped the packaging across its Vengeance DDR5 lineup, adopting a new approach to combat retail scams and theft.
2026 @ NIWA Trading
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